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ds-ixd_609-r00d preliminary 1 rohs 2002/95/ec e 3 pb features ? 9a peak source/sink drive current ? wide operating voltage range: 4.5v to 35v ? -40c to +125c extended operating temperature range ? logic input withstands negative swing of up to 5v ? matched rise and fall times ? low propagation delay time ? low, 10 a supply current ? low output impedance applications ? efficient power mosfet and igbt switching ? switch mode power supplies ? motor controls ? dc to dc converters ? class-d switching amplifiers ? pulse transformer driver description the ixdd609/ixdi609/ixdn609 high-speed gate drivers are especially well suited for driving the latest ixys mosfets and igbts. the ixd_609 high-current output can source and sink 9a of peak current while producing voltage rise and fall times of less than 25ns. the input is cmos compatible, and is virtually immune to latch up. proprietary circuitry eliminates cross-conduction and current ?shoot-through.? low propagation delay and fast, matched rise and fall times make the ixd_609 family ideal for high-frequency and high-power applications. the ixdd609 is configured as a non-inverting driver with an enable, the ixdn609 is configured as a non-inverting driver, and the ixdi609 is configured as an inverting driver. the ixd_609 family is available in a standard 8-pin dip (pi); 8-lead soic (sia); 8-lead soic with an exposed, grounded metal back (si); an 8-lead dfn (d2) package; and a 5-pin to-263 package. ordering information part number logic configuration package type packing method quantity IXDD609D2TR 8-lead dfn tape & reel 2000 ixdd609si 8-lead soic with exposed grounded metal back tube 100 ixdd609sitr 8-lead soic with exposed grounded metal back tape & reel 2000 ixdd609sia 8-lead soic tube 100 ixdd609siatr 8-lead soic tape & reel 2000 ixdd609pi 8-pin dip tube 50 ixdd609yi 5-pin to-263 tube 50 ixdi609si 8-lead soic with exposed grounded metal back tube 100 ixdi609sitr 8-lead soic with exposed grounded metal back tape & reel 2000 ixdi609sia 8-lead soic tube 100 ixdi609siatr 8-lead soic tape & reel 2000 ixdi609pi 8-pin dip tube 50 ixdi609yi 5-pin to-263 tube 50 ixdn609si 8-lead soic with exposed grounded metal back tube 100 ixdn609sitr 8-lead soic with exposed grounded metal back tape & reel 2000 ixdn609sia 8-lead soic tube 100 ixdn609siatr 8-lead soic tape & reel 2000 ixdn609pi 8-pin dip tube 50 ixdn609yi 5-pin to-263 tube 50 i n e n out i n out i n out ixd_609 9-ampere low-side ultrafast mosfet drivers
ixd_609 r00d preliminary 2 1. specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.4 recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.5 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.6 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.7 thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2. functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 ixdd609 functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 ixdi609 functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 ixdn609 functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.4 timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.5 characteristics test diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3. performance data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4. manufacturing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.1 mechanical dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
ixd_609 r00d preliminary 3 1 specifications 1.1 pin configurations 1.2 pin definitions 1.3 absolute maximum ratings unless stated otherwise, absolute maximum electrical ratings are at 25c absolute maximum ratings are stress rating s. stresses in excess of these ratings c an cause permanent damage to the device. functional operation of the device at condit ions beyond those indicated in the operational sections of this data sheet is not implied. 1 4 3 2 8 5 6 7 v cc i n e n g n d v cc out out g n d 1 4 3 2 5 v cc out g n d i n e n 1 4 3 2 8 5 6 7 v cc i n n c g n d v cc out out g n d 1 4 3 2 5 v cc out g n d i n n c 1 4 3 2 8 5 6 7 v cc i n n c g n d v cc out out g n d 1 4 3 2 5 v cc out g n d i n n c ixdd609 d2 / pi / si / sia ixdi609 pi / si / sia ixdn609 pi / si / sia ixdd609 yi ixdi609 yi ixdn609 yi pin name description in logic input en output enable - drive pin low to disable output, and force output to a high impedance state out output - sources or sinks current to turn-on or turn-off a discrete mosfet or igbt out inverted output - sources or sinks current to turn-on or turn-off a discrete mosfet or igbt v cc supply voltage - provides power to the device gnd ground - common ground reference for the device nc not connected parameter symbol minimum maximum units supply voltage v cc -40v all other pins - -0.3 v cc +0.3 v output current i out -9a junction temperature t j -55 +150 c storage temperature t stg -65 +150 c
ixd_609 4 preliminary r00d 1.4 recommended operating conditions 1.5 electrical characteristics test conditions: t a =25c, 4.5v < v cc < 35v. parameter symbol minimum maximum units supply voltage v cc 4.5 35 v operating temperature range t a -40 +125 c parameter conditions symbol minimum typical maximum units input voltage, high 4.5v < v cc < 18v v ih 3.0 - - v input voltage, low 4.5v < v cc < 18v v il --0.8 input voltage range - v in -5 - v cc +0.3 input current 0v < v in < v cc i in -10 - 10 a en input voltage, high ixdd609 only v enh 2/3v cc -- v en input voltage, low ixdd609 only v enl -- 1/3v cc output voltage, high - v oh v cc -0.025 -- v output voltage, low - v ol - - 0.025 output resistance, high state v cc =18v, i out =-10ma r oh -0.61 output resistance, low state v cc =18v, i out =10ma r ol -0.40.8 output current, continuous limited by package power dissipation i dc --2a rise time c load =10nf, v cc =18v t r -2245 ns fall time c load =10nf, v cc =18v t f -1540 on-time propagation delay c load =10nf, v cc =18v t ondly -3750 off-time propagation delay c load =10nf, v cc =18v t offdly -3850 enable to output-high delay time ixdd609 only t enoh -3550 disable to high impedance state delay time ixdd609 only t dold -7080 enable pull-up resistor - r en -200-k power supply current v cc =18v, v in =3.5v i cc -13ma v cc =18v, v in =0v --10 a v cc =18v, v in =v cc --10
ixd_609 r00d preliminary 5 1.6 electrical characteristics test conditions: t a =-40c to +125c, 4.5v < v cc < 35v, t j <150c. 1.7 thermal characteristics parameter conditions symbol minimum typical maximum units input voltage, high 4.5v < v cc < 18v v ih 3.0 - - v input voltage, low 4.5v < v cc < 18v v il --0.8 input voltage range - v in -5 - v cc +0.3 input current 0v < v in < v cc i in -10 - 10 a output voltage, high - v oh v cc -0.025 -- v output voltage, low - v ol - - 0.025 output resistance, high state v cc =18v, i out =-10ma r oh --2 output resistance, low state v cc =18v, i out =10ma r ol --1.5 output current, continuous limited by package power dissipation i dc --1a rise time c load =10nf, v cc =18v t r --60 ns fall time c load =10nf, v cc =18v t f --60 on-time propagation delay c load =10nf, v cc =18v t ondly --55 off-time propagation delay c load =10nf, v cc =18v t offdly --40 enable to output-high delay time ixdd609 only t enoh --60 disable to high impedance state delay time ixdd609 only t dold --100 power supply current v cc =18v, v in =3.5v i cc -13ma v cc =18v, v in =0v --10 a v cc =18v, v in =v cc --10 package parameter rating units d2 (8-lead dfn) ja 35 c/w pi (8-lead dip) 125 si (8-lead soic with exposed metal back) 85 sia (8-lead soic) 120 yi (5-lead to-263) 46
ixd_609 6 preliminary r00d 2 functional description 2.1 ixdd609 functional block diagram 2.2 ixdi609 functional block diagram 2.3 ixdn609 functional block diagram in en out 0 1 or open 0 1 1 or open 1 00 z 10 z in out 0 1 1 0 g n d i n e n ixdd609 v cc out i n v cc ixdi609 g n d out in out 0 0 1 1 i n v cc ixdn609 g n d out
ixd_609 r00d preliminary 7 2.4 timing diagrams 2.5 characteristics test diagram 10% 90% t o n delay t offdelay t r t f v ih v il i n out 10% 90% t o n delay t offdelay t f t r v ih v il i n out e n i n out g n d v cc v cc + - v i n 0.1 f10 f tektronix c u rrent pro b e 6302 c load
ixd_609 8 preliminary r00d 3 performance data supply volta g e (v) 0 5 10 15 20 25 30 35 rise time (ns) 0 10 20 30 40 50 60 70 rise time vs. supply volta g e (input=0-5v, f=10khz, t a =25oc) c l =10nf c l =5.4nf c l =1.5nf supply volta g e (v) 0 5 10 15 20 25 30 35 fall time (ns) 0 10 20 30 40 50 60 fall time vs. supply volta g e (input=0-5v, f=10khz, t a =25oc) c l =10nf c l =5.4nf c l =1.5nf temperature (oc) -40-200 204060 8 0 100 120 140 rise & fall times (ns) 5 6 7 8 9 10 11 rise and fall times vs. temperature (input=0-5v, f=10khz, c l =2.5nf, v cc =18v) t r t f load capacitance (pf) 0 2000 4000 6000 8 000 10000 rise time (ns) 0 10 20 30 40 50 60 70 rise time vs. load capacitance v cc =4.5 v v cc = 8v v cc =12 v v cc =1 8v v cc =25 v v cc =30 v v cc =35 v load capacitance (pf) 0 2000 4000 6000 8 000 10000 fall time (ns) 0 10 20 30 40 50 60 fall time vs. load capacitance v cc =4.5 v v cc = 8v v cc =12 v v cc =1 8v v cc =25 v v cc =30 v v cc =35 v supply volta g e (v) 0 5 10 15 20 25 30 35 propa g ation delay (ns) 0 50 100 150 200 propa g ation delay vs. supply volta g e (input=0-5v, f=1khz, c l =5.4nf) t offdly t ondly input volta g e (v) 246 8 10 12 propa g ation delay (ns) 0 20 40 60 8 0 100 120 140 160 1 8 0 propa g ation delay vs. input volta g e (v in =5v, f=1khz, c l =5.4nf, v cc =12v) t o n dly t offdly temperature (oc) -40-200 204060 8 0 100 120 140 propa g ation delay (ns) 30 35 40 45 50 55 propa g ation delay vs. junction temperature (f=1khz, c l =5.4nf, v cc =18v) t o n dly t offdly temperature (oc) -40-200 204060 8 0 100 120 140 input threshold volta g e (v) 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2. 8 input threshold volta g e vs. temperature (c l =2.5nf, v cc =18v) min v ih max v il supply volta g e (v) 0 5 10 15 20 25 30 35 input threshold (v) 1.0 1.5 2.0 2.5 3.0 3.5 input threshold vs. supply volta g e min v ih max v il supply volta g e (v) 0 5 10 15 20 25 30 35 enable threshold (v) 0 5 10 15 20 25 enable threshold vs. supply volta g e min v e n h max v e n l
ixd_609 r00d preliminary 9 load capacitance (pf) 1000 10000 supply current (ma) 0 100 200 300 400 500 supply current vs. load capacitance (v cc =18v) f=2mhz f=1mhz f=500khz f=100khz f=50khz f=10khz f=1khz load capacitance (pf) 1000 10000 supply current (ma) 0 50 100 150 200 250 300 supply current vs. load capacitance (v cc =12v) f=2mhz f=1mhz f=500khz f=100khz f=50khz f=10khz f=1khz load capacitance (pf) 1000 10000 supply current (ma) 0 50 100 150 200 supply current vs. load capacitance (v cc =8v) f=2mhz f=1mhz f=500khz f=100khz f=50khz f=10khz f=1khz frequency (khz) 1 10 100 1000 10000 supply current (ma) 0.1 1 10 100 1000 supply current vs. frequency (v cc =18v) c l =10nf c l =5.4nf c l =1.5nf frequency (khz) 1 10 100 1000 10000 supply current (ma) 0.1 1 10 100 1000 supply current vs. frequency (v cc =12v) c l =10nf c l =5.4nf c l =1.5nf frequency (khz) 1 10 100 1000 10000 supply current (ma) 0.01 0.1 1 10 100 1000 supply current vs. frequency (v cc =8v) c l =10nf c l =5.4nf c l =1.5nf temperature (oc) -40-200 204060 8 0 100 120 140 supply current (ma) 0.0 0.2 0.4 0.6 0. 8 1.0 1.2 1.4 quiescent supply current vs. temperature v i n =3.5 v v i n =5 v v i n =10 v v i n =0 v & 1 8v temperature (oc) -40-200 204060 8 0 100 120 140 supply current (ma) 0.35 0.40 0.45 0.50 0.55 0.60 0.65 dynamic supply current vs. temperature (v in =5v, f=1khz, c l =1.5nf, v cc =18v) supply volta g e (v) 0 5 10 15 20 25 30 35 source current (a) -30 -25 -20 -15 -10 -5 0 output source current vs. supply volta g e (f=422hz, c l =66nf) supply volta g e (v) 0 5 10 15 20 25 30 35 output sink current (a) 0 5 10 15 20 25 30 output sink current vs. supply volta g e (f=422hz, c l =66nf)
ixd_609 10 preliminary r00d supply volta g e (v) 0 5 10 15 20 25 30 35 output resistance ( ) 0.0 0.5 1.0 1.5 hi g h state output resistance at -10ma vs. supply volta g e supply volta g e (v) 0 5 10 15 20 25 30 35 output resistance ( ) 0.2 0.3 0.4 0.5 0.6 0.7 0. 8 0.9 1.0 1.1 low state output resistance at +10ma vs. supply volta g e temperature (oc) -40-200 204060 8 0 100 120 140 output source current (a) -12.0 -11.5 -11.0 -10.5 -10.0 -9.5 -9.0 output source current vs. temperature (f=422hz, c l =66nf, v cc =18v) temperature (oc) -40-200 204060 8 0 100 120 140 output sink current (a) 10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 output sink current vs. temperature (f=422hz, c l =66nf, v cc =18v)
ixd_609 r00d preliminary 11 4 manufacturing information 4.1 mechanical dimensions 4.1.1 8-pin soic - ixd_609sia 4.1.2 8-pin soic - ixd_609si recommended pcb land pattern dimensions mm mi n / mm max (inches mi n / inches max) 1.30 / 1.75 (0.051 / 0.069) 0.10 / 0.25 (0.004 / 0.010) 4. 8 0 / 5.00 (0.190 / 0.197) pi n 1 0.31 / 0.51 (0.012 / 0.020) 5. 8 0 / 6.20 (0.22 8 / 0.244) 3. 8 0 / 4.00 (0.150 / 0.157) 1.27 bsc (0.05 bsc) 0.40 / 1.27 (0.016 / 0.050) 0.10 / 0.25 (0.004 / 0.010) 0.25 / 0.50 x45o (0.010 / 0.020 x45o) 0o / 8 o 1.27 (0.050) 5.40 (0.213) 1.55 (0.061) 0.60 (0.024) n ote: molded package conforms to jedec standard config u ration ms-012 v ariation aa. recommended pcb land pattern dimensions mm mi n / mm max (inches mi n / inches max) n ote: molded package conforms to jedec standard config u ration ms-012 v ariation ba. 1.30 / 1.75 (0.051 / 0.069) 0.03 / 0.10 (0.001 / 0.004) 4. 8 0 / 5.00 (0.190 / 0.197) pi n 1 0.31 / 0.51 (0.012 / 0.020) 5. 8 0 / 6.20 (0.22 8 / 0.244) 3. 8 0 / 4.00 (0.150 / 0.157) 1.27 bsc (0.05 bsc) 0.40 / 1.27 (0.016 / 0.050) 0.10 / 0.25 (0.004 / 0.010) 0.25 / 0.50 x45o (0.010 / 0.020 x45o) 0o / 8 o 2.29 / 2.79 (0.090 / 0.110) 3.30 / 3. 8 1 (0.130 / 0.150) 1.27 (0.050) 5.40 (0.209) 1.55 (0.061) 0.60 (0.024) 2.75 (0.10 8 ) 3. 8 0 (0.150)
ixd_609 12 preliminary r00d 4.1.3 8-pin dfn - ixd_609d2 4.1.4 8-pin dip - ixd_609pi dimensions mm mi n / mm max (inches mi n / inches max) 5.00 bsc (0.197 bsc) 4.00 bsc (0.15 8 bsc) 0. 8 0 / 1.00 (0.031 / 0.039) 0.00 / 0.05 (0.000 / 0.002) 0.95 bsc (0.037 bsc) 0.76 / 0. 8 1 (0.030 / 0.032) 0.30 / 0.45 (0.012 / 0.01 8 ) 3.04 / 3.09 (0.120 / 0.122) 2.54 / 2.59 (0.100 / 0.102) 0.35 / 0.45 x 45o (0.014 / 0.01 8 x 45o) pin 1 pin 1 pin 8 0.20 ref (0.00 8 ref) recommended pcb land pattern 4.50 (0.177) 0.45 (0.01 8 ) 1.20 (0.047) 3.05 (0.120) 2.55 (0.100) 0.95 (0.037) 0.35 x 45o (0.014 x 45o) dimensions mm mi n / mm max (inches mi n / inches max) n ote: molded package conforms to jedec standard config u ration ms-001 v ariation ba. pc board pattern 7.62 / 10.92 (0.300 / 0.430) 7.62 bsc (0.300 bsc) 0.20 / 0.3 8 (0.00 8 / 0.015) 7.37 / 8 .26 (0.290 / 0.325) 0.3 8 / 0.5 8 (0.015 / 0.023) 1.14 / 1.65 (0.045 / 0.065) 0.3 8 / 1.02 (0.015 / 0.040) 3.05 / 3. 8 1 (0.120 / 0.150) 3.43 / 4.70 (0.135 / 0.1 8 5) 3.1 8 / 3. 8 1 (0.125 / 0.150) 8 -0.900 dia. ( 8 -0.035 dia.) 7.50 (0.295) 2.540 (0.100) 9.02 / 10.16 (0.355 / 0.400) 6.10 / 6. 8 6 (0.240 / 0.270) 2.540 bsc (0.100 bsc) 1.40 (0.055)
ixd_609 r00d preliminary 13 4.1.5 5-pin to-263 - ixd_609yi dime n sio n s mm mi n / mm max (inches mi n / inches / max) n otes: 1. all metal s u rfaces are solder solder-plated except trimmed area. 2. short lead of n o. 3 is optional to ixys. 3. n o. 3 lead is connected to n o. 6 lead ( b ottom heat sink) internally. 8 . 8 0 / 9.50 (0.346 / 0.374) 14. 8 0 / 15. 8 0 (0.5 8 3 / 0.622) 9.65 / 10.30 (0.3 8 0 / 0.406) 1.70 bsc (0.067 bsc) 1 2 3 4 5 0.60 / 0.99 (0.024 / 0.039) 1.00 / 1.40 (0.039 / 0.055) 4.20 / 4. 8 0 (0.165 / 0.1 8 9) 1.20 / 1.40 (0.047 / 0.055) 0.40 / 0.70 (0.016 / 0.02 8 ) 2.24 / 2. 8 4 (0.0 88 / 0.112) 2.10 / 2.70 (0.0 8 3 / 0.106) 0o - 3o 6.60 / 7.20 (0.260 / 0.2 8 3) 7.50 / 8 .20 (0.295 / 0.323) 1.20 / 1.70 (0.047 / 0.067) 6 optional 3. 8 5 (0.152) 3.65 (0.144) 6.35 (0.250) 1.05 (0.041) 1.70 (0.067) 10.40 (0.409) 9.15 (0.360) recommended pcb pattern for additional information please vi sit our website at: www.clare.com clare, inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publica tion and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity are expressed or implied. except as set forth in clare?s standard terms and conditions of sale, clare, inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of clare?s product may result in direct physical harm, i njury, or death to a person or severe property or environmental damage. clare, inc. reserves the right to discontinue or ma ke changes to its products at any time without notice. specification: ds-ixd_609-r00d ?copyright 2010, clare, inc. all rights reserved. printed in usa. 7/7/2010

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